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LSM330DLC陀螺仪电动自平衡独轮车。有一个问题 LSM330DLC 后 回流焊料。 该 LSM330DLC 有偏移来检测 从垂直方向的角度。偏移可能是0-7度,但它们仍然处于良好的工作状态。我制造了1000个单位 LSM330DLC 基于控制器两次使用 回流焊料 。 该比例约为15%,这已经抵消了问题。其他人都很好。 如何解决这个问题呢? 你觉得吗? LSM330DLC 是 受潮湿? 谨慎 LSM330DLC如下。 1.密封袋打开后,必须进行回流焊接的设备 a)安装在:工厂条件下的168小时以下为原文 We used LSM330DLC Gyroscopes in electric self-balancing unicycle. There is one problem of LSM330DLC after reflow solder. The LSM330DLC has offset to detect the angle from the vertical direction. The offset may be 0-7 degree, but they are still in good working condition.I made 1000 units of LSM330DLC based controller two times using reflow solder . The ratio is about 15% that has offset problem. Others are good. How to solve this problem? Do you think the LSM330DLC are affected by damp? The caution about LSM330DLC is as follows. 1.After sealed bag is opened, devices that subjected to reflow solder must a) mounted within: 168 hours at factory conditions <30 ℃/60%RH b) stored at <10 ℃/60%RH The LSM330DLC is not stored with above condition I really didn't bake them befor reflow solder. Do you think the offset problem can be solved if I baked the LSM330DLC before reflow solder? Thanks my email is: xmgatech@gmail.com |
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我可能错了,但它可能是正常的零g偏移分布。
它在数据表中表示为60mg典型值,这通常意味着这是1-sigma值。 换句话说,只有68%的设备适合这个数字。大约95%将适合+/- 120mg,其余的可以达到+/- 180mg(如果我们假设ST不允许超出生产的设备偏差超过3-sigma)。 可能你应该为每块电路板做一些零克校准并将其存储在NV存储器中。 还要注意,它会随着温度而变化,从上电到上电循环可能无法完全重复。 以上来自于谷歌翻译 以下为原文 I may be wrong but it could be a normal zero-g offset distribution. It is stated as 60mg typical value in the datasheet, which usually means that this is 1-sigma value. In other words only 68% of devices will fit in this number. About 95% will fit within +/-120mg and the rest could go up to +/-180mg (if we assume that ST is not allowing more than 3-sigma deviation of the devices out of the production). Probably you shall do some zero-g calibration for each board and store it in a NV memory. Be aware also that it will change with the temperature and might be not fully repeatable from power on to power on cycle. |
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